The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC, in collaboration with leading program leaders for national onshoring initiatives, have announced a three-day workshop dedicated to discussing and promoting strategies to improve On-Shoring Advanced Packaging and Assembly.
Speakers at the event include leaders of critical projects ►
June 29, 2023- The Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA) celebrated the grand opening of its new collaborative lab space at the NSWC Crane Westgate area.
As part of the grand opening ceremony of the new collaboration lab, members of the NSTXL team, ►
To expand collaboration within the microelectronics ecosystem and highlight the RAMP program, the S²MARTS OTA hosted a two-day RAMP Awareness event in Washington D.C. on May 10 – 11. During this event, RAMP performer Microsoft was able to give key insights on the progress of the RAMP project
SpEC is excited to attend the 38th annual Space Symposium Conference this year, taking place in scenic Colorado Springs from April 17th through April 20th in an awe-inspiring venue that features breathtaking mountain views in The Broadmoor, a five-star, world-renowned hotel.
The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems, Inc.
Did you know that the Space Enterprise Consortium (SpEC), Space System Command’s Other Transaction Agreements (OTAs) vehicle, has awarded nearly $2 billion in government contracts since its inception? And did you also know that 60 percent of those contracts include new, non-traditional defense innovators?
Visit the Space Enterprise Consortium (SpEC) team at Space Mobility and SpaceCom in Orlando, Florida February 21-23rd in booth #423. Learn how year-over-year, the SpEC network has continuously grown by 36%, awarding almost $2 billion in contracts, 60% of which has gone to new technology innovators.
The Microelectronics Commons program is a first of its kind approach aimed at decreasing our dependency on other nations for microelectronics. The Department of Defense is looking to cast a wide net on the technology industry and Defense Industrial Base (DIB) to innovate and collaborate to successfully deliver on a project of this scale.
The Microelectronics Commons Industry Days was a two-day event designed to provide deep dives into the six technology areas vital to the Microelectronics Commons program: Secure Edge/IoT Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap-Ahead Technologies.
Join NSTXL at I/ITSEC in Orlando, Florida and meet our team Nov. 28th – Dec 2nd in booth #1223. See first-hand how NSTXL supports Government acquisition of mission-critical technology, as well as fosters small businesses looking to break into government contracting.
