In order to create a secure and robust microelectronics infrastructure for U.S. national defense, we need to make sure State of the Art (SOTA) Heterogenous Integrated Packaging (SHIP) is put into action. STAMP is your pathway to be among the first U.S. innovators to apply SHIP technology to your projects. During the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) Awareness Day event, Dr. Darren Crum, Advanced Packaging Lead, Office of the Undersecretary of Defense for Research & Engineering, provided initial information about the STAMP project to the Defense Industrial Base for awareness of the Request for Solutions coming in the near future.
Completed technical specs are on the horizon and the DoD is ready to transition advanced Multi-chip Packages (MCPs) into military systems. Stay tuned for updates!