The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems, Inc.
Industrial technology has always played a critical role in the defense sector. In recent years, additive manufacturing has begun to play an even more critical role in weapon design and prototype development. This is due to the many advantages that additive manufacturing offers over traditional manufacturing methods.
Russia is amping up is hypersonics weapons campaigns against Ukraine. North Korea recently claimed it has tested their own fleet of hypersonic missiles, a claim that has been deemed credible. Top U.S. generals openly state that China’s hypersonic developments are “very concerning”.
The Additively Manufactured Prototypes (AMP) for Hardware Technology Protection (HTP) has been awarded utilizing the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA) vehicle. The Naval Surface Warfare Center, Crane Division has awarded $1.6 Million to Mercury Systems, Raytheon, Charles Stark Draper, Johns Hopkins University Applied Physics Laboratory, and Lockheed Martin.
The United States is in a hypersonic race against two of the world’s most advanced militaries, Russia and China. With the potential that Hypersonic technology holds, we must consider the impact of it in the hands of other nations.
Since its inception in 2019, S²MARTS has effectively been able to move forward multiple contracts to support the Department of the Navy and America’s Warfighters. Now, celebrating its four-year anniversary S²MARTS has awarded over $1 Billion in government contracts. The management of S²MARTS by NSTXL and its close relationship with NSWC Crane has led to S²MARTS undeniable success.
The Microelectronics Commons program is a first of its kind approach aimed at decreasing our dependency on other nations for microelectronics. The Department of Defense is looking to cast a wide net on the technology industry and Defense Industrial Base (DIB) to innovate and collaborate to successfully deliver on a project of this scale.
In 2022, we welcomed 300 new member organizations across 64 technology focus areas, 75% representing Small, Non-Traditional organizations. This year, our members top technology areas included 5G, Microelectronics, Hypersonics, and Space Awareness.
The Microelectronics Commons Industry Days was a two-day event designed to provide deep dives into the six technology areas vital to the Microelectronics Commons program: Secure Edge/IoT Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap-Ahead Technologies.
The DoW Office of the Under Secretary of Defense, Research and Engineering (OUSW(R&E)) Trusted and Assured Microelectronics (T&AM) Program is initiating the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) project to quickly field the microelectronic advancements the State-of-the-art Heterogeneous Integrated Packaging (SHIP) prototyping project has developed.
The primary objective of the ►
