Visit the Space Enterprise Consortium (SpEC) team at Space Mobility and SpaceCom in Orlando, Florida February 21-23rd in booth #423. Learn how year-over-year, the SpEC network has continuously grown by 36%, awarding almost $2 billion in contracts, 60% of which has gone to new technology innovators.
The idea of classification hints at a fundamentally different type of ML algorithms: Unsupervised Learning. In Unsupervised Learning, there are no longer pre-labeled data sets for training; the algorithms instead identify natural groupings within the data, known as Clusters.
The Microelectronics Commons program is a first of its kind approach aimed at decreasing our dependency on other nations for microelectronics. The Department of Defense is looking to cast a wide net on the technology industry and Defense Industrial Base (DIB) to innovate and collaborate to successfully deliver on a project of this scale.
In 2022, we welcomed 300 new member organizations across 64 technology focus areas, 75% representing Small, Non-Traditional organizations. This year, our members top technology areas included 5G, Microelectronics, Hypersonics, and Space Awareness.
The Microelectronics Commons Industry Days was a two-day event designed to provide deep dives into the six technology areas vital to the Microelectronics Commons program: Secure Edge/IoT Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap-Ahead Technologies.
Join NSTXL at I/ITSEC in Orlando, Florida and meet our team Nov. 28th – Dec 2nd in booth #1223. See first-hand how NSTXL supports Government acquisition of mission-critical technology, as well as fosters small businesses looking to break into government contracting.
The DoW Office of the Under Secretary of Defense, Research and Engineering (OUSW(R&E)) Trusted and Assured Microelectronics (T&AM) Program is initiating the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) project to quickly field the microelectronic advancements the State-of-the-art Heterogeneous Integrated Packaging (SHIP) prototyping project has developed.
The primary objective of the ►
The Department of Defense (DoD) is releasing its Growing Additive Manufacturing Maturity for Airbreathing Hypersonics (GAMMA-H) prototype opportunity in its efforts to expand current manufacturing processes to intricate hypersonic weapons parts.
The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
In this episode of CEO Talks, NSTXL Founder and CEO Tim Greeff is joined by Rocket Lab Founder and CEO Peter Beck as they discuss navigating the challenges on the horizon for space tech development, private/public partnerships for space innovation, and the future of space advancement.
