Intel, Qorvo, and DoD Officially Celebrate Delivery of Microelectronics Advancements to the Defense Industrial Base
lucianstxl2023-04-07T07:08:45-07:00The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems, Inc.


