NSWC Crane Awards Hardware in the Loop Infrastructure Project

2023-11-20T11:43:52-08:00

Naval Surface Warfare Center (NSWC), Crane has awarded the Environmental Simulation Hardware in the Loop (ES-HWIL) project to Hill Technical Solutions on October 11, 2023. This project was awarded using the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA).

This project is focused on the development ►

NSWC Crane Awards Hardware in the Loop Infrastructure Project2023-11-20T11:43:52-08:00

Third Annual SpEC General Member Meeting

2026-03-17T15:14:25-07:00

Designed to provide actionable takeaways for industry, academia, and government, the 2023 SpEC General Member Meeting took place in Los Angeles on October 16th and 17th, where members attended two days ►

Third Annual SpEC General Member Meeting2026-03-17T15:14:25-07:00

Microelectronics Commons Kicks Off at Annual Event

2026-03-17T15:15:18-07:00

The Microelectronics Commons Annual Meeting took place in Washington, D.C. on October 17-18 and hosted over 700 in-person and 1.1k virtual attendees, including members of the Microelectronics Commons program, the newly awarded Hub leads and their teams, key government players, industry performers and more. This event featured briefings from Department ►

Microelectronics Commons Kicks Off at Annual Event2026-03-17T15:15:18-07:00

Join SpEC at Space and Missile Defense Symposium and Huntsville Social Event

2026-03-17T15:59:18-07:00

Space Enterprise Consortium (SpEC) will attend the 2023 Space and Missile Defense Symposium (SMD), taking place at the Von Braun Center in Huntsville, Alabama, from August 8-10.

The SMD Symposium stands as one of the largest and most impactful educational, networking, and professional development events in the space ►

Join SpEC at Space and Missile Defense Symposium and Huntsville Social Event2026-03-17T15:59:18-07:00

IMAPS and IPC to Host Three-Day Workshop on On-Shoring Advanced Packaging and Assembly Strategies

2026-03-17T16:02:56-07:00

The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC, in collaboration with leading program leaders for national onshoring initiatives, have announced a three-day workshop dedicated to discussing and promoting strategies to improve On-Shoring Advanced Packaging and Assembly.  

Speakers at the event include leaders of critical projects ►

IMAPS and IPC to Host Three-Day Workshop on On-Shoring Advanced Packaging and Assembly Strategies2026-03-17T16:02:56-07:00

S²MARTS Celebrates the Grand Opening of the new Collaboration Lab

2026-03-17T16:03:33-07:00

June 29, 2023- The Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA) celebrated the grand opening of its new collaborative lab space at the NSWC Crane Westgate area.

As part of the grand opening ceremony of the new collaboration lab, members of the NSTXL team, ►

S²MARTS Celebrates the Grand Opening of the new Collaboration Lab2026-03-17T16:03:33-07:00

RAMP Awareness Days Brings Together DIB and Government to Secure Future Microelectronics Systems

2026-03-17T16:13:07-07:00

To expand collaboration within the microelectronics ecosystem and highlight the RAMP program, the S²MARTS OTA hosted a two-day RAMP Awareness event in Washington D.C. on May 10 – 11. During this event, RAMP performer Microsoft was able to give key insights on the progress of the RAMP project

RAMP Awareness Days Brings Together DIB and Government to Secure Future Microelectronics Systems2026-03-17T16:13:07-07:00

The Future of Space is NOW! Visit SpEC at the 2023 Space Symposium Conference

2023-04-13T12:51:03-07:00

SpEC is excited to attend the 38th annual Space Symposium Conference this year, taking place in scenic Colorado Springs from April 17th through April 20th in an awe-inspiring venue that features breathtaking mountain views in The Broadmoor, a five-star, world-renowned hotel.

The Future of Space is NOW! Visit SpEC at the 2023 Space Symposium Conference2023-04-13T12:51:03-07:00

Intel, Qorvo, and DoD Officially Celebrate Delivery of Microelectronics Advancements to the Defense Industrial Base

2023-04-07T07:08:45-07:00

The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems, Inc.

Intel, Qorvo, and DoD Officially Celebrate Delivery of Microelectronics Advancements to the Defense Industrial Base2023-04-07T07:08:45-07:00
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