The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC, in collaboration with leading program leaders for national onshoring initiatives, have announced a three-day workshop dedicated to discussing and promoting strategies to improve On-Shoring Advanced Packaging and Assembly.
Speakers at the event include leaders of critical projects ►
June 29, 2023- The Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA) celebrated the grand opening of its new collaborative lab space at the NSWC Crane Westgate area.
As part of the grand opening ceremony of the new collaboration lab, members of the NSTXL team, ►
General Electric has been awarded the Classified Test Material for Hypersonics (CTMH) opportunity in the amount of $7.9 million to provide the Department of the Navy (DoN) a prototype that fabricates three articles (two unclassified and one classified) using Chemical Vapor Infiltration (CVI) Carbon/Silicon Carbide (C/SiC) densification of carbon fiber ►
June 09, 2023 – L3Harris, a global leader in technology solutions, has been awarded the scope to develop a mission payload design to support the Missile Track Custody (MTC) program, through the Space Enterprise Consortium (SpEC) Other Transaction Authority (OTA) vehicle. The U.S. government recently selected L3Harris to join ►
On June 17, 2023, the MACH-TB program successfully launched its first suborbital testbed vehicle in a critical step forward toward advancing U.S. hypersonic technology.
To expand collaboration within the microelectronics ecosystem and highlight the RAMP program, the S²MARTS OTA hosted a two-day RAMP Awareness event in Washington D.C. on May 10 – 11. During this event, RAMP performer Microsoft was able to give key insights on the progress of the RAMP project
R&D in the military leads to the latest technological advancement. While the U.S. military works to stay ahead of the rest of the world, this requires hard work and reliable resources. Here's 7 R&D trends happening in 2023.
SpEC is excited to attend the 38th annual Space Symposium Conference this year, taking place in scenic Colorado Springs from April 17th through April 20th in an awe-inspiring venue that features breathtaking mountain views in The Broadmoor, a five-star, world-renowned hotel.
The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems, Inc.
Space Enterprise Consortium (SpEC), managed by National Security Technology Accelerator has awarded $18 million to General Dynamics Information Technology (GDIT) for the Enigma prototype project. The Enigma project will support Space Systems Command (SSC) in building the USSF’s digital backbone in support of the acquisition mission.
