S²MARTS Project No. 22-16
View all Microelectronics Commons documents in this folder.
Solutions Due: 28 Feb 2023 at 12:00 PM ET
Questions Due: 27 Jan 2023 at 12:00 PM ET
Industry Days Q&A Release: 9 Jan 2023 at 4:30 PM ET
Capability Pitch Days: 09-20 Jan 2023
Q&A Release 2: 13 Dec 2022 at 2:00 PM ET
Industry Days: 7 – 8 Dec 2022 in the D.C. Area
RFS Release and Q&A Release 1: 30 Nov 2022 at 3:00 PM ET
Core Pitch Days: 29 Nov – 1 Dec 2022
Awareness Day: 9 November 2022 at 1:00 PM ET
Coming Soon Notice: 15 September 2022 at 12:00 PM ET
Q&A Release 3: 18 Jan 2023 at 2:00 PM ET
Q&A Release 4: 27 Jan 2023 at 1:00 PM ET
Request For Solutions
The Government is pleased to announce that the Request for Solutions for Proj. 22-16 Microelectronics Commons is now available. Please find the document below and its accompanying attachments. The Government is pleased to announce that the Request for Solutions for Proj. 22-16 Microelectronics Commons is now available. Please find the document below and its accompanying attachments.
Request for Solutions: S2MARTS 22-16 Microelectronics Commons RFS Final
Questions & Answers
Following the events for the Microelectronics Commons opportunity, the Government has released a set of Questions & Answers intended to provide further clarity on this effort.
Q&A Release 2
Q&A Release 3
Q&A Release 4
As a reminder, an initial set of Questions & Answers was released that addressed questions submitted during the virtual Awareness Day event. This same document can be found in the past events section of this page under “Awareness Day”.
Q&A Release 1
Teaming List Available
Are you interested in teaming for the Microelectronics Commons opportunity? Fill out the form below and you’ll receive the teaming list via email shortly.
Teaming List Request Form
By filling out this form, your company consents to sharing your information with other companies requesting the Teaming List. Please allow 1 – 2 business days for your information to be added to the online list you will receive via email.
7 – 8 December 2022 in the D.C. Area
This event was an in person, two-day Microelectronics Commons Industry Day with presentations from government program offices and exclusive networking opportunities.
This agenda was provided in advance of the upcoming Microelectronics Commons Industry Day. The Agenda showcases the six (6) panels that discussed each of the six (6) technology areas related to the Program. We also had several key note speakers and special topics during the day event.
View Industry Days Resources
Core Pitch Days
29 Nov – 1 Dec
During Core Pitch Days, potential Cores had the opportunity to showcase their capabilities and qualifications to potential Hubs. In order to participate as a Core or a Hub, you must have met the requirements listed in the registration form.
View Core Pitch Days Resources
Thank you to those who attended the Microelectronics Commons Awareness Day. Please find the slides and recording from the event below.
Watch the Recording
Download the Slides
The Government has released answers to the questions submitted during the Microelectronics Commons Awareness Day virtual event. Please find the document below.
View Q&A Responses
Coming Soon Notice
Coming Soon Notice:
15 September 2022 at 12:00 PM ET
The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Microelectronics program has a need for domestic prototyping capability to accelerate technology demonstration. Processes, materials, devices, and architectures must be developed and quickly ported and re-characterized as they are transitioned from academia and industry to small-volume prototyping and then scaled up for production. Due to the very high complexity of integrated microelectronic systems today, there is an urgent need to establish a network of domestic prototyping facilities to demonstrate, at-scale, the system-level benefits of innovations in microelectronics materials, processes, devices, and architectural designs. Demonstrating at-scale commercial viability is required to close the gap between innovation and market adoption.
However, at-scale prototyping is high-risk and expensive. As a result, small and mid-size companies and universities have great difficulty bridging the “Valley of Death” between research ideas and realization of those ideas into full manufacturing. In particular, prototyping capabilities for six application areas that are critical to the DoD will be supported. Those areas are: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electronic Warfare, and Commercial Leap Ahead Technologies. The end-state goal is to develop a national network of regional innovation hubs and core facilities distributed across the U.S. that will reduce barriers to innovation, mature emerging microelectronics technologies, enhance existing microelectronics infrastructure, and foster a pipeline of domestic talent and innovative ideas.
The Microelectronics Commons Other Transaction Authority (OTA) prototype project is anticipated to be released and be executed within a 60-month period.