Watch the recording to hear directly from the government about the upcoming Microelectronics Commons initiative.

Hosted by Shaun Davis, Doug Crowe, Bryan Smith, and Dr. Allison Smith, featuring a presentation from Dr. Dev Shenoy, Principal Director, Microelectronics, OUSD/R&E, Director, Defense Microelectronics Cross Functional Team (DMCFT).

ANNUAL DUES

Members in our Network receive access to support services aimed at maximizing exposure and creating business and collaboration opportunities to market and promote their technologies and capabilities to prospective U.S. Government and private sector buyers.

Corporate

Annual Revenue Annual Dues
< $10M $250
$10M – $50M $1,000
$50M – $100M $5,000
$100M + $10,000

Non-Profit

Annual Revenue Annual Dues
< $50M $500
$50M – $100M $5,000
$100M+ $10,000

Academic & Other

Types Annual Dues
University $2,500
Laboratory $2,500
Incubator $500
Investor $2,500

*To be eligible for SpEC membership, you will need to provide a DD2345 form during membership registration. Please see additional information on SpEC’s website.

Upcoming

Events

Industry Day

December 7 – 8, 2022 at The Ronald Reagan Building & International Trade Center in Washington D.C.

Join us in person for a two day Microelectronics Commons Industry Day with presentations from government program offices and exclusive networking opportunities.

Core Pitch Days

November 29- December 1, 2022 | Hosted Virtually

During Pitch Days, potential Cores will have the opportunity to showcase their capabilities and qualifications to potential Hubs. In order to participate as a Core or a Hub, you must meet the requirements listed in the registration form.

About the Microelectronics Commons

The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Microelectronics program has a need for domestic prototyping capability to accelerate technology demonstration. The end-state goal is to develop a national network of regional innovation hubs and core facilities distributed across the U.S. that will reduce barriers to innovation, mature emerging microelectronics technologies, enhance existing microelectronics infrastructure, and foster a pipeline of domestic talent and innovative ideas.