Core Pitch Days
November 29- December 1
Virtual
During Pitch Days, potential Cores will have the opportunity to showcase their capabilities and qualifications to potential Hubs.
Potential Hubs, please register and a schedule/invite will be provide prior to the event.
In order to participate and present as a Core, you must meet the requirements listed below.
Core Facilities (Cores) are entities with the capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. They provide Hubs with access to repeatable processes, back-end manufacturing/integration, and full flow-fabrication (i.e., Cores have scalable capacity beyond what the regional Hubs will be required to provide). Core facilities will provide access to ≥200-mm tooling for prototyping silicon-compatible technologies and/or ≥100-mm tooling for compound semiconductor technologies.
Registration for Pitch Days is now closed.
ANNUAL DUES
Members in our Network receive access to support services aimed at maximizing exposure and creating business and collaboration opportunities to market and promote their technologies and capabilities to prospective U.S. Government and private sector buyers.
Corporate
| Annual Revenue | Annual Dues |
|---|---|
| < $10M | $250 |
| $10M – $50M | $1,000 |
| $50M – $100M | $5,000 |
| $100M + | $10,000 |
Non-Profit
| Annual Revenue | Annual Dues |
|---|---|
| < $50M | $500 |
| $50M – $100M | $5,000 |
| $100M+ | $10,000 |
Academic & Other
| Types | Annual Dues |
|---|---|
| University | $2,500 |
| Laboratory | $2,500 |
| Incubator | $500 |
| Investor | $2,500 |
*To be eligible for SpEC membership, you will need to provide a DD2345 form during membership registration. Please see additional information on SpEC’s website.
What is a Core?
Core Facilities (Cores) are entities with the capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. They provide Hubs with access to repeatable processes, back-end manufacturing/integration and full flow-fabrication (i.e., Cores have scalable capacity beyond what the regional Hubs will be required to provide). Core facilities will provide access to ≥200-mm tooling for prototyping silicon compatible technologies and/or ≥100-mm tooling for compound semiconductor technologies.
What is a Hub?
Hubs connect researchers and designers to prototyping capabilities targeted to regional strengths in the Hub’s technical topic area. They will be competitively selected based on expertise and capabilities in the region.
Hubs will concentrate on one or more of six technology areas including: Secure Edge/IoT Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electronic Warfare, and Commercial Leap-Ahead Technologies.
About the Microelectronics Commons
The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Microelectronics program has a need for domestic prototyping capability to accelerate technology demonstration. The end-state goal is to develop a national network of regional innovation hubs and core facilities distributed across the U.S. that will reduce barriers to innovation, mature emerging microelectronics technologies, enhance existing microelectronics infrastructure, and foster a pipeline of domestic talent and innovative ideas.
