Industry Day

December 7 – 8, 2022
The Ronald Reagan Building & International Trade Center

Join us in person for a two day Microelectronics Commons Industry Day with presentations from government program offices and exclusive networking opportunities. Registration to attend in person is $75 and includes entry to the event on both days, exclusive networking events, and catered breakfast, lunch, and social.

This agenda is subject to change. Preview the current agenda here.

Space is limited. Companies and Universities can register up to three representatives for the in person event. Each attendee must register themselves. This registration limit does not apply to government attendees.

Registration for Industry Days is now closed.


Members in our Network receive access to support services aimed at maximizing exposure and creating business and collaboration opportunities to market and promote their technologies and capabilities to prospective U.S. Government and private sector buyers.


Annual Revenue Annual Dues
< $10M $250
$10M – $50M $1,000
$50M – $100M $5,000
$100M + $10,000


Annual Revenue Annual Dues
< $50M $500
$50M – $100M $5,000
$100M+ $10,000

Academic & Other

Types Annual Dues
University $2,500
Laboratory $2,500
Incubator $500
Investor $2,500

*To be eligible for SpEC membership, you will need to provide a DD2345 form during membership registration. Please see additional information on SpEC’s website.

Speakers & Sessions

Dr. Ronnie Chatterji

White House Coordinator for CHIPS Implementation

Dr. David Honey

Deputy Under Secretary of Defense for Research and Engineering (DUSD(R&E)

Dr. Dev Shenoy

Principal Director, Microelectronics, OUSD/R&E, Director, Defense Microelectronics Cross Functional Team (DMCFT)

Dr. Alison Smith

Microelectronics Commons Lead, OUSD/R&E

Department of Commerce CHIPS Strategy

Featuring Eric K. Lin, Interim Director for the CHIPS R&D Office

New Approaches to Increasing Capital for Semiconductor Entrepreneurs

Featuring Dr. Jason Rathje, OUSD R&E

Accelerating Technology, Innovation and Partnerships

Featuring Dr. Erwin Gianchandani, Assistant Director of the Directorate for Technology, Innovation and Partnerships (TIP)

A&S Perspective

Featuring Dr. Christine Michienzi, ST, Chief Technology Officer (OUSD(A&S)), DoD

Live Panels

Quantum Technology Panel

Chair – Dr. John Burke, Principal Director for Quantum Science for the Office of the Undersecretary of Defense for Research and Engineering (OUSD (R&E)).

Panelists – Dr. Robert Bedford, Air Force, Dr. David Hucul, Air Force, Mr. TR Govindan, Army, and Dr. Gerry Borsuk, Navy.

5G/6G Technology Panel

Chair – Dr. Tom Rondeau, Principal Director for FutureG & 5G for the Office of the Undersecretary of Defense for Research and Engineering (OUSD (R&E))

Panelists – Dr. Dennis Walker Jr, Air Force, Dr. Romeo Del Rosario, Army, and Dr. Joshua Hawke, Navy.

Secure Edge/IoT Computing Panel

Chair – Mr. Peter O’Donnell

Panelists – Mr. Jonathan Heiner, Air Force, Dr. Timothy Morgan, Navy, and Mr. Joey Mathews, Navy.

Artificial Intelligence Hardware Panel

Chair – Dr. Qing Wu

Panelists – Dr. Scott Douglass, Air Force, Dr. Marc Ulrich, Army, Mr. Forrest Bussler, Army, and Mr. Hans Cho, Navy.

Electromagnetic Warfare Panel

Chair – Ms. Stacey Mervyn

Panelists – Dr. James Schrock, Air Force, Dr. Ben Voetberg, Air Force, Dr. William Diehl, Army, Dr. Frank Klemm, Navy, Lt. Col. Ben Voetberg, and Mr. John Schofield, Navy.

Commercial Leap-Ahead Technologies Panel

Chair – Dr. Gregory Forcherio

Panelists – Mr. John Blevins, Air Force, Dr. Neil Merrett, Air Force, Dr. William Benard, Army, and Dr. Fritz Kub, Navy.

The Ronald Reagan Building & International Trade Center

1300 Pennsylvania Avenue NW, Washington, DC 20004

Located on historic Pennsylvania Avenue in the heart of Washington, DC, within walking distance of the White House, the U.S Capitol Building, the Smithsonian Museums, many other historical sites and cultural organizations.

About the Microelectronics Commons

The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Microelectronics program has a need for domestic prototyping capability to accelerate technology demonstration. The end-state goal is to develop a national network of regional innovation hubs and core facilities distributed across the U.S. that will reduce barriers to innovation, mature emerging microelectronics technologies, enhance existing microelectronics infrastructure, and foster a pipeline of domestic talent and innovative ideas.