In order to create a secure and robust microelectronics infrastructure for U.S. national defense, we need to make sure State of the Art (SOTA) Heterogenous Integrated Packaging (SHIP) is put into action. STAMP is your pathway to be among the first U.S. innovators to apply SHIP technology to your projects. During the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) Awareness Day event, Dr. Darren Crum, Advanced Packaging Lead, Office of the Undersecretary of Defense for Research & Engineering, provided initial information about the STAMP project to the Defense Industrial Base for awareness of the Request for Solutions coming in the near future. Completed technical specs are on the horizon and the DoD is ready to transition advanced Multi-chip Packages (MCPs) into military systems. Stay tuned for updates!
You are cordially invited to attend the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Awareness Day, hosted by the Office of the Secretary of Defense for Research & Engineering (OUSD(R&E)) Trusted & Assured Microelectronics Program (T&AM), October 12–13, 2022, at the Booz Allen Hamilton Conference Center in McLean, VA. SHIP prototype microelectronic devices are now in production and will be available to the DoD acquisition community and the Defense Industrial Base as standard products in 2023. This event serves as an opportunity for engagement across the SHIP stakeholder enterprise to discuss current efforts and build the foundation for SHIP device transition to DoD systems.