S2MARTS

More Than 390 of the Nation’s Leading Innovators Join Together for Three Weeks of Technology Pitch Days

2023-01-30T09:55:12-08:00

The Microelectronics Commons program is a first of its kind approach aimed at decreasing our dependency on other nations for microelectronics. The Department of Defense is looking to cast a wide net on the technology industry and Defense Industrial Base (DIB) to innovate and collaborate to successfully deliver on a project of this scale.

More Than 390 of the Nation’s Leading Innovators Join Together for Three Weeks of Technology Pitch Days2023-01-30T09:55:12-08:00

Microelectronics Commons Prototype Giving Much Needed Boost to American Microelectronics Industrial Base

2023-01-24T11:59:26-08:00

The Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) has proposed a prototype project to close the gap between microelectronics innovation and market adoption. The prototype project- Microelectronics Commons - will enable lab-to-fab prototyping– that is, evolve microelectronics laboratory prototyping to fabrication prototyping – in domestic facilities.

Microelectronics Commons Prototype Giving Much Needed Boost to American Microelectronics Industrial Base2023-01-24T11:59:26-08:00

2022 Year in Review

2023-01-10T17:21:10-08:00

In 2022, we welcomed 300 new member organizations across 64 technology focus areas, 75% representing Small, Non-Traditional organizations. This year, our members top technology areas included 5G, Microelectronics, Hypersonics, and Space Awareness.

2022 Year in Review2023-01-10T17:21:10-08:00

NSTXL Hosts Microelectronics Commons Industry Days

2022-12-18T16:41:19-08:00

The Microelectronics Commons Industry Days was a two-day event designed to provide deep dives into the six technology areas vital to the Microelectronics Commons program: Secure Edge/IoT Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap-Ahead Technologies. 

NSTXL Hosts Microelectronics Commons Industry Days2022-12-18T16:41:19-08:00

DoD Rapidly Transitioning Microelectronic Technology into Field through STAMP

2022-12-19T08:34:09-08:00

The DoD Office of the Under Secretary of Defense, Research and Engineering (OUSD(R&E)) Trusted and Assured Microelectronics (T&AM) Program is initiating the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) project to quickly field the microelectronic advancements the State-of-the-art Heterogeneous Integrated Packaging (SHIP) prototyping project has developed.

The primary objective of the ►

DoD Rapidly Transitioning Microelectronic Technology into Field through STAMP2022-12-19T08:34:09-08:00

Growing Additive Manufacturing Maturity for Airbreathing Hypersonics (GAMMA-H) Prototype Opportunity to Propel Manufacturing to Hypersonic Systems

2023-03-07T12:06:59-08:00

The Department of Defense (DoD) is releasing its Growing Additive Manufacturing Maturity for Airbreathing Hypersonics (GAMMA-H) prototype opportunity in its efforts to expand current manufacturing processes to intricate hypersonic weapons parts.

Growing Additive Manufacturing Maturity for Airbreathing Hypersonics (GAMMA-H) Prototype Opportunity to Propel Manufacturing to Hypersonic Systems2023-03-07T12:06:59-08:00

America’s Field of (Microchip) Dreams

2022-11-04T06:25:19-07:00

“Build it and they will come.” The phrase has been used in business for decades—a way of saying, ‘start that company and it will succeed.’ And while baseball fans flocked to the Field of Dreams in the iconic movie from 1989, anyone who has started a business knows, it takes more than just a great idea. It takes that plus dedication, persistence and a solid strategy. Sometimes it also takes incentives, big monetary incentives.

America’s Field of (Microchip) Dreams2022-11-04T06:25:19-07:00

Microelectronics Commons Prototype Leading the Drive to Secure Microelectronics Manufacturing

2022-12-06T05:46:36-08:00

From cars to phones to computers, there aren’t many things these days that don’t use microelectronics, and the United States is in dire need them. Currently, over 85% of microelectronics used in the United States are fabricated outside the U.S. The Department of Defense recognizes the risk of possible security ►

Microelectronics Commons Prototype Leading the Drive to Secure Microelectronics Manufacturing2022-12-06T05:46:36-08:00

Hypersonics Advanced Manufacturing Test Capability (HAMTC) Awarded to Fiber Materials, Inc. and Purdue Applied Research Institute

2022-08-09T05:29:53-07:00

S2MARTS has announced that Hypersonics Advanced Manufacturing Test Capability Test (HAMTC) has been awarded to Fiber Materials, Inc. and Purdue Applied Research Institute. With modern hypersonic weapons capable of traveling over five times the speed of sound, technology has never moved faster than it does today.

Hypersonics Advanced Manufacturing Test Capability (HAMTC) Awarded to Fiber Materials, Inc. and Purdue Applied Research Institute2022-08-09T05:29:53-07:00

Additive Manufacturing (AM) for Technology Protection (TP) Awardees selected using S2MARTS OTA

2022-10-19T08:09:43-07:00

The Additive Manufacturing for Technology Protection prototype project selected six performers through the S²MARTS OTA. Powered by NSTXL, S2MARTS is the DoD’s premier rapid OT contracting vehicle for flexible acquisition in trusted microelectronics, strategic & spectrum mission, and other critical mission areas.

Additive Manufacturing (AM) for Technology Protection (TP) Awardees selected using S2MARTS OTA2022-10-19T08:09:43-07:00
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