DoD Rapidly Transitioning Microelectronic Technology into Field through STAMP


The DoD Office of the Under Secretary of Defense, Research and Engineering (OUSD(R&E)) Trusted and Assured Microelectronics (T&AM) Program is initiating the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) project to quickly field the microelectronic advancements the State-of-the-art Heterogeneous Integrated Packaging (SHIP) prototyping project has developed.

The primary objective of the ►