Stimulating Transition for Advanced Microelectronics Packaging (STAMP)

Thank you for your interest in this opportunity which is now closed. Please note that documentation pertaining to this project is no longer available.

STAMP Awareness Day: 8 September 2022 at 2:30 PM ET

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STAMP Opportunity Overview

The SHIP Program – also referred to as State of the Art Heterogeneous Integrated Packaging – is developing four prototype Multichip Packages (MCPs).

Building off of the successful SHIP program, a pilot will be established to facilitate the transition of these MCPs to military systems by partnering with the Defense Industrial Base. The pilot program will be called Stimulating Transition for Advanced Microelectronics Packaging (STAMP).

This will be accomplished by leveraging alignment to existing DoD Programs to transition the MCP technology to a program of record system. Advantages for military system developers and integrators include:

• Access to processing devices specifically designed in collaboration with DoD to meet DoD computing needs
• Access to next-generation at-the-edge sensor computing designed in collaboration DoD
• SOTA technologies will provide your systems with cutting-edge technology improvements – dramatically accelerating your technology roadmap of processing/computing devices with significantly reduced SWAP and increased performance

So if you want your company and programs to have access to the best commercial technologies for military applications with measurable security, please consider engaging with this opportunity.

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More on SHIP (State of the Art Heterogeneous Integrated Packaging)

To learn more about SHIP, view the opportunity page here. The primary objective of the SHIP prototype project will be to demonstrate a novel approach to a secure, assessable, and cost effective SOTA integrated, design, assembly, and test leveraging the expertise of commercial industry.

For more information on Phase II of the SHIP Prototype Project, view the opportunity page here.