Industry Day
December 7 – 8, 2022
The Ronald Reagan Building & International Trade Center
Join us in person for a two day Microelectronics Commons Industry Day with presentations from government program offices and exclusive networking opportunities. Registration to attend in person is $75 and includes entry to the event on both days, exclusive networking events, and catered breakfast, lunch, and social.
This agenda is subject to change. Preview the current agenda here.
Space is limited. Companies and Universities can register up to three representatives for the in person event. Each attendee must register themselves. This registration limit does not apply to government attendees.
Registration for Industry Days is now closed.
ANNUAL DUES
Members in our Network receive access to support services aimed at maximizing exposure and creating business and collaboration opportunities to market and promote their technologies and capabilities to prospective U.S. Government and private sector buyers.
Corporate
Annual Revenue | Annual Dues |
---|---|
< $10M | $250 |
$10M – $50M | $1,000 |
$50M – $100M | $5,000 |
$100M + | $10,000 |
Non-Profit
Annual Revenue | Annual Dues |
---|---|
< $50M | $500 |
$50M – $100M | $5,000 |
$100M+ | $10,000 |
Academic & Other
Types | Annual Dues |
---|---|
University | $2,500 |
Laboratory | $2,500 |
Incubator | $500 |
Investor | $2,500 |
*To be eligible for SpEC membership, you will need to provide a DD2345 form during membership registration. Please see additional information on SpEC’s website.
Speakers & Sessions

Dr. Ronnie Chatterji
White House Coordinator for CHIPS Implementation

Dr. David Honey
Deputy Under Secretary of Defense for Research and Engineering (DUSD(R&E)

Dr. Dev Shenoy
Principal Director, Microelectronics, OUSD/R&E, Director, Defense Microelectronics Cross Functional Team (DMCFT)

Dr. Alison Smith
Microelectronics Commons Lead, OUSD/R&E
Department of Commerce CHIPS Strategy
Featuring Eric K. Lin, Interim Director for the CHIPS R&D Office
New Approaches to Increasing Capital for Semiconductor Entrepreneurs
Featuring Dr. Jason Rathje, OUSD R&E
Accelerating Technology, Innovation and Partnerships
Featuring Dr. Erwin Gianchandani, Assistant Director of the Directorate for Technology, Innovation and Partnerships (TIP)
A&S Perspective
Featuring Dr. Christine Michienzi, ST, Chief Technology Officer (OUSD(A&S)), DoD
Live Panels
Quantum Technology Panel
Chair – Dr. John Burke, Principal Director for Quantum Science for the Office of the Undersecretary of Defense for Research and Engineering (OUSD (R&E)).
Panelists – Dr. Robert Bedford, Air Force, Dr. David Hucul, Air Force, Mr. TR Govindan, Army, and Dr. Gerry Borsuk, Navy.
5G/6G Technology Panel
Chair – Dr. Tom Rondeau, Principal Director for FutureG & 5G for the Office of the Undersecretary of Defense for Research and Engineering (OUSD (R&E))
Panelists – Dr. Dennis Walker Jr, Air Force, Dr. Romeo Del Rosario, Army, and Dr. Joshua Hawke, Navy.
Secure Edge/IoT Computing Panel
Chair – Mr. Peter O’Donnell
Panelists – Mr. Jonathan Heiner, Air Force, Dr. Timothy Morgan, Navy, and Mr. Joey Mathews, Navy.
Artificial Intelligence Hardware Panel
Chair – Dr. Qing Wu
Panelists – Dr. Scott Douglass, Air Force, Dr. Marc Ulrich, Army, Mr. Forrest Bussler, Army, and Mr. Hans Cho, Navy.
Electromagnetic Warfare Panel
Chair – Ms. Stacey Mervyn
Panelists – Dr. James Schrock, Air Force, Dr. Ben Voetberg, Air Force, Dr. William Diehl, Army, Dr. Frank Klemm, Navy, Lt. Col. Ben Voetberg, and Mr. John Schofield, Navy.
Commercial Leap-Ahead Technologies Panel
Chair – Dr. Gregory Forcherio
Panelists – Mr. John Blevins, Air Force, Dr. Neil Merrett, Air Force, Dr. William Benard, Army, and Dr. Fritz Kub, Navy.
The Ronald Reagan Building & International Trade Center
1300 Pennsylvania Avenue NW, Washington, DC 20004
Located on historic Pennsylvania Avenue in the heart of Washington, DC, within walking distance of the White House, the U.S Capitol Building, the Smithsonian Museums, many other historical sites and cultural organizations.

About the Microelectronics Commons
The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Microelectronics program has a need for domestic prototyping capability to accelerate technology demonstration. The end-state goal is to develop a national network of regional innovation hubs and core facilities distributed across the U.S. that will reduce barriers to innovation, mature emerging microelectronics technologies, enhance existing microelectronics infrastructure, and foster a pipeline of domestic talent and innovative ideas.