Access the Best Commercial Technologies for Military Applications

The DoD is committed to advancing U.S. microelectronics. But, involvement and collaboration from every corner of the nation is critical as the DoD begins to put the capabilities of SHIP into the field.

Be one of the first to learn about the upcoming Stimulating Transition for Advanced Microelectronics Packaging (STAMP) project with Dr. Darren Crum, the USD R&E Team, and S2MARTS Director Doug Crowe.


Members in our Network receive access to support services aimed at maximizing exposure and creating business and collaboration opportunities to market and promote their technologies and capabilities to prospective U.S. Government and private sector buyers.


Annual Revenue Annual Dues
< $10M $250
$10M – $50M $1,000
$50M – $100M $5,000
$100M + $10,000


Annual Revenue Annual Dues
< $50M $500
$50M – $100M $5,000
$100M+ $10,000

Academic & Other

Types Annual Dues
University $2,500
Laboratory $2,500
Incubator $500
Investor $2,500

*To be eligible for SpEC membership, you will need to provide a DD2345 form during membership registration. Please see additional information on SpEC’s website.

New Microelectronics Capabilities will be Available Soon. How Can you Integrate them into Military Systems?

The DoD is ready to transition advanced Multichip Packages (MCPs) into military systems.

Access to processing devices specifically designed in collaboration with DoD to meet DoD computing needs.

Leverage a pathway to next-generation at-the-edge sensor computing designed in collaboration with DoD.

Introduce SOTA technologies that will provide systems with cutting-edge technology improvements – dramatically accelerating the technology roadmap of processing/computing devices with significantly reduced SWAP and increased performance.


The SHIP Program – also referred to as State of the Art Heterogeneous Integrated Packaging – is developing four prototype Multichip Packages (MCPs). Building off of the successful SHIP program, a pilot will be established to facilitate the transition of these MCPs to military systems by partnering with the Defense Industrial Base. The pilot program will be called Stimulating Transition for Advanced Microelectronics Packaging (STAMP).