This opportunity is now closed
Thank you for your interest in this opportunity which is now closed. Please note that documentation pertaining to this project is no longer available.
Very High Density Interconnects
This project will seek proposals for the development of prototype processes and materials for the manufacture of very high density substrate, interposer and redistribution layer electronic device packaging interconnect products using polymer based substrate materials.
PROJECT TIMELINE
Coming Soon Notice:
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RFS Release:
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RNI Release:
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Questions Due:
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Q&A Responses:
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Solution Due:
June 14, 2019 12:00 pm ET
Award Notice:
August 27, 2019 12:00 am ET
Awareness Day:
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Awareness Day:
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Innovator NETWORX:
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