Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)

S²MARTS Project No. 22-17

Innovator NETWORX: 31 October 2022 at 12:00 PM ET

Coming Soon Notice: 20 October 2022 at 10:00 AM ET


COMING SOON NOTICE

The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Trusted & Assured Microelectronics program is seeking advanced packaging prototype devices that will 1) transition into a targeted military system and 2) be made available to the Defense Industrial Base (DIB) for broad use in military systems.

Microelectronics (ME) are, and will continue to be, the underlying fabric of Department of Defense (DoD) warfighting capabilities. Virtually all the top Under Secretary Defense (USD) Research & Engineering (R&E) priorities rely on some form of advanced, specialized microelectronics. Because of this fundamental reliance on a single enabling technology, the DoD must have assured access to microelectronics for superior system performance. To meet this need, the State-of-the-art Heterogeneous Integrated Packaging (SHIP) program was established under the Trusted and Assured Microelectronics (T&AM) program to develop advanced packaging prototype devices to facilitate the development and use of a self-sustained access model to state-of-the-art (SOTA) microelectronics Advanced Packaging (AP) for DoD applications.

The SHIP access model will leverage existing industry packaging trends and flows to design and build prototypes that will be transitioned into DoD systems. Commercial trends, such as chiplet-based architectures, heterogeneous integration, and 2.5D/3D packaging, have presented a new opportunity for the DoD to have access to SOTA devices customized for DoD applications. The T&AM program’s AP Technical Execution Area (TEA) will work to support process pipe cleaning and maturation efforts through the development and delivery of an expanded portfolio of prototype devices that are designed to meet military system requirements to facilitate transition. Ultimately, there will be a portfolio of prototype devices developed by the AP TEA, which will be designed and built as a proof-of-concept and cover a wide array of military use cases. To aid in the maturation of the SHIP model and to continually grow the DoD portfolio of advanced packaged devices, DoD is seeking new prototyping and transition projects under STEAM PIPE, as the next iteration of SHIP program prototypes.

The DoD objective is for the prototypes to enable military system designers and integrators to address known capability gaps against current and future threats. Prototypes are needed that can reduce SWAP-C, increase system performance, add capability, and enable military system modernization. STEAM PIPE will be focused on 1) efforts to facilitate transition of available SOTA prototype advanced packaged devices and chiplets and 2) new advanced packaging and chiplet prototype development and transition. Prototyping and transition are equally important components in the STEAM PIPE project. Partnerships among the microelectronics industry and the Defense Industrial Base (DIB) will be critical to achieve the goals of STEAM PIPE, and teams are encouraged to build relationships and engage early with DoD system acquisition stakeholders for proposed advanced packaging and chiplet solutions in anticipation of this effort.

The STEAM PIPE Other Transaction Authority (OTA) prototype project period of performance will be defined based on the performer’s proposed schedule, but is currently estimated to be complete within 5 years for the entire effort. Individual Request For Solutions (RFS) will be released each year to focus on specific DoD needs. Each project award is expected to be 12-36 months.

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PROJECT TIMELINE

Coming Soon Notice:

October 20, 2022 10:00 am

RFS Release:

Questions Due:

Q&A Responses:

Solution due:

Award Notice:

Innovator NETWORX:

October 31, 2022 12:00 pm

Project TALX:

1-on-1 Meetings:

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