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Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)

S²MARTS Project No. 23-02

Solutions Due: 13 February 2023 at 12:00 PM ET

RFS Rev 1: 27 January 2023 at 11 AM ET

Project TALX Q&A Responses: 26 January 2023 at 1:00 PM ET

Project TALX: 20 January 2023 at 1:00 PM ET

Questions Due: 5 January 2023 at 12:00 PM ET

RFS Release: 15 December 2022 at 4:00 PM ET

Innovator NETWORX: 31 October 2022 at 12:00 PM ET

Coming Soon Notice: 20 October 2022 at 12:00 PM ET

Not a member but interested in learning more? Fill out the form to access the opportunity documentation.


During this hour-long event on 20 January, the Government team shared insights into the STEAM PIPE opportunity and answered questions from attendees. To view the event recording and slide deck, fill out the "Request To See Documents" form on the right-hand side of this page.



The Government has provided additional modifications to the RFS regarding project number, chiplet prototype projects, project phases, design, fabrication, testing, security, classification, and proposal structure. Non-members interested in viewing the information should complete the Key Document request form.


The Government has released the Request for Solutions for the STEAM PIPE opportunity.

Solutions are due on 13 February 2023 at 12:00 PM ET.

To review the documents, please fill out the document request form on the right.


The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Trusted & Assured Microelectronics program is seeking advanced packaging prototype devices that will 1) transition into a targeted military system and 2) be made available to the Defense Industrial Base (DIB) for broad use in military systems.

Microelectronics (ME) are, and will continue to be, the underlying fabric of Department of Defense (DoD) warfighting capabilities. Virtually all the top Under Secretary Defense (USD) Research & Engineering (R&E) priorities rely on some form of advanced, specialized microelectronics. Because of this fundamental reliance on a single enabling technology, the DoD must have assured access to microelectronics for superior system performance. To meet this need, the State-of-the-art Heterogeneous Integrated Packaging (SHIP) program was established under the Trusted and Assured Microelectronics (T&AM) program to develop advanced packaging prototype devices to facilitate the development and use of a self-sustained access model to state-of-the-art (SOTA) microelectronics Advanced Packaging (AP) for DoD applications.


Coming Soon Notice:

October 20, 2022 10:00 am PST

RFS Release:

December 15, 2022 4:00 pm PST

Questions Due:

January 5, 2023 12:00 pm PST

Q&A Responses:


Solution due:

February 13, 2023 12:00 pm PST

Award Notice:


Innovator NETWORX:

October 31, 2022 12:00 pm PST

Project TALX:

January 20, 2023 1:00 pm PST

1-on-1 Meetings: