Strategic Transition of microElectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE 24)

Thank you for your interest in this opportunity which is now closed. Please note that documentation pertaining to this project is no longer available.

S²MARTS Project No. 24-01

Q&A RELEASE

The Government team has answered your questions regarding STEAM PIPE 24. To review the documents, please fill out the document request form on the right.

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PROJECT TALX

Friday, 08 March 2024 from 12:00 PM - 1:00 PM ET

During this hour-long event, the Government team shared additional details about the project. Their insight into the opportunity is invaluable in crafting your solution.

You can access the STEAM PIPE 24 Project TALX Q&A, recording and slide deck by filling out the Key Document Request form on the right.

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REQUEST FOR SOLUTIONS

The Government has released the Request for Solution (RFS) for the STEAM PIPE 24 opportunity. If you have any questions regarding the RFS, you can submit them until 04 March 2024 at 12:00 PM ET and the final solutions are due by 10 April 2024 at 12:00 PM ET.

To review the RFS and its accompanying documents, fill out the key document request form on the right of this page.

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COMING SOON NOTICE

As to the next iteration to STEAM PIPE, the Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Trusted & Assured Microelectronics program is seeking advanced packaging prototype devices that will 1) transition into a targeted military system and 2) be made available to the Defense Industrial Base (DIB) for broad use in military systems.

Microelectronics (ME) are, and will continue to be, the underlying fabric of Department of Defense (DoD) warfighting capabilities. Virtually all the top Under Secretary Defense (USD) Research & Engineering (R&E) priorities rely on some form of advanced, specialized microelectronics. Because of this fundamental reliance on a single enabling technology, the DoD must have assured access to microelectronics for superior system performance. To meet this need, the State-of-the-art Heterogeneous Integrated Packaging (SHIP) program was established under the Trusted and Assured Microelectronics (T&AM) program to develop advanced packaging prototype devices to facilitate the development and use of a self-sustained access model to state-of-the-art (SOTA) microelectronics advanced packaging (AP) for DoD applications.

The STEAM PIPE 24 Other Transaction Authority (OTA) prototype project will be defined by the performer’s proposed schedule but is estimated within a 12-36 month period for the entire effort.

To view the full Coming Soon notice, please fill out the Request form to See Documents on the right side of the page.

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AWARENESS DAY

During this event, the Government team shared additional details about the project. You can view the Awareness Day slide deck and Q&A from the Government by filling out the Key Documents Request form on the right side of the page.

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TEAMING LIST AVAILABLE

Are you interested in teaming for the STEAM PIPE 24 opportunity? Fill out the Teaming List form here STEAM PIPE 24 Teaming Request and you’ll receive the teaming list via email.

Important Note

By filling out this form, your company consents to sharing your information with other companies requesting the Teaming List. Please allow 1 – 2 business days for your information to be added to the online list you will receive via email.

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REQUEST FOR NETWORK INSIGHT

This S2MARTS announcement is intended to pulse NSTXL’s Innovation Network to discover potential solutions that will evolve the STEAM PIPE effort. This request is for planning purposes only and does not constitute a Request for Solution (RFS) or an invitation to submit formal proposals. The Government & NSTXL are not liable for reimbursing any costs associated with response preparation and submission. A response is not required to participate in future proposal opportunities.

Naval Surface Warfare Center, Crane Division ( NSWC Crane), Trusted Microelectronics Division (GXV), is interested in possibly pursuing a similar effort to the STEAM PIPE project recently awarded. The STEAM PIPE focus is to design, prototype, productize, and transition needed military system capability using chiplets (as defined by IEEE) and advanced heterogeneous integrated (HI) packaging.