Microelectronics Commons Electromagnetic Warfare

Call for Projects Electromagnetic Warfare Projects

California Defense Ready Electronics and Microdevices Superhub (CA DREAMS)

• • GaN Amplifier Prototypes Targeting Microwave to Submillimeter-wave Frequency Spectrum ($16.2M) 
    • The award aims to mature advanced gallium nitride (GaN) technology to enable broad-spectrum, high power, and high efficiency solutions for future DoD EW systems. The project will develop GaN amplifier chipsets from the microwave to the sub-millimeter wave frequency spectrum making advancements at the semiconductor-device, the integrated circuit, and the package level.

Midwest Microelectronics Consortium (MMEC)

• • Co-packaged Reconfigurable Signal and Intelligence Architecture (CORSAIR) ($8.6M)
    • Fully programmable, RF-enabled dual-use chiplet targeting >20x system-level performance versus incumbent technology in signal processing and artificial intelligence via a novel Configurable Spatial Architecture (CSA) runtime, reconfigurable array (RTRA).
    • Reshore processor manufacturing.
  • Center for Technology Transition and Rapid Prototyping of Infrared Detectors ($8.8M) 
    • Cost-effective advanced large-format 3D infrared focal plane arrays (IRFPAs) by integrating pre-screened high-yield Digital Read Out Integrated Circuit (DROIC) chiplets with seamless large infrared sensor array via a high-yield, high-aspect-ratio interposer wafer.
    • Prototype a broad-band midwave-infrared (MWIR) detector with a nominal of 4k x 4k resolution and a 10 µm pixel pitch.

Northeast Microelectronics Coalition (NEMC)

• • LADDER: a giant Leap AheaD for all filter DesignERs! ($4M) 
    • Project delivers a bulk acoustic wave (BAW) filter creation tool, enabling all electrical engineers to rapidly design filters to meet given specifications, thus enabling broader adoption of BAW filters in Radar, Electromagnetic Warfare, Comms, and general commercial applications spanning S through X and Ku bands.
  • Wideband Same‐Frequency STAR Array Platform Based on Heterogeneous Multi-Domain Self‐Interference Cancellation ($5.6M) 
    • Project focused on the development of wideband same-frequency STAR array platforms for next-generation EW applications.

Silicon Crossroads Microelectronics Commons (SCMC)

• • High-Performance Diamond Electronics for Next Generation Defense Systems ($6.2M) 
    • This project seeks to to develop a new generation of diamond-based high power radio frequency (RF) transistors for future electronic warfare systems and the associated power transistors to condition the sensor prime power.

Call for Projects Project Information Below is No Longer Current due to Submission Deadline Closing

The Microelectronics Commons Call for Projects has been amended.

A summary of amendments are as follows:

D1 – Added Submission Directions
D2 – Added EDA Tools and IP and Core Access Report // Letters of Support// References//Added Does not count towards 20-page limit
D3(c)- Added EDA Tools / Letters of Support/Heilmeier Responses/References
D4 – Added 15) Identify technology area, topic number(s), and project proposal number XX of 15 (e.g Project Proposal 1 of 15)
D5- Title change to “ Contents of Price Response”
D5 – Removed “severable” from instructions table (Payable Milestone Schedule)

You can find the complete amended Call for Projects under Key Documents.

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Project Background

In 2023, the Department of Defense (DoD) established the Microelectronics Commons – a network of eight regional Hubs to evolve laboratory prototypes to fabrication prototypes and to strengthen the semiconductor workforce. Annually, Hubs will compete for project awards. These annual project awards may include infrastructure (physical, digital, and human) required to accomplish the proposed prototypes. This Call for Projects (CFP) describes the desired capabilities for which project proposals are being sought.

Microelectronics Commons Hub facilities include laboratory prototype capabilities, which typically includes ≤100 mm and ≤200 mm tooling for compound semiconductor and silicon based technologies, respectively. Hubs can also generate and mature prototypes for Cores to scale up for subsequent potential selection by the National Semiconductor Technology Center (NSTC) and/or industrial microelectronics companies, such as fabless or Integrated Device Manufacturers (IDMs), for commercialization. The role of the regional Hubs is to connect researchers and designers to prototyping capabilities targeted to strengths in the Hub’s technical topic areas.

Microelectronics Commons Cores are fabs/foundries, manufacturing facilities where semiconductor devices are manufactured, that have scalable capacity for prototyping beyond what the regional Hubs can provide (fab prototyping). They are available for use by innovators that run the gamut from university and small business up to large industrial concerns. Cores typically have 300 mm capabilities for silicon-based technologies (other sizes are technology appropriate) and are facilities that can demonstrate prototypes with the volume and characteristics required to ensure reduced risk for manufacturing. Cores serve a dual function: First, they serve to further complement and advance the work of the regional Hubs; i.e., they are integral to the Hubs themselves. For example, they provide capabilities at ≥200 mm wafer fab for silicon complimentary metal-oxide-semiconductor- (CMOS-) compatible technologies and ≥100 mm wafer fab for compound semiconductors. Second, they serve to engage with commercial fabs and better align regional Hubs to commercial processes to facilitate transition of technologies.

Current State and Desired End-State

Innovative prototypes to include microelectronics materials, processes, devices, and architectural designs will be supported. Activities executed within Microelectronics Commons shall primarily fall under Budget Activity (BA) 3, although activities that fall under Budget Activities 2 and 4 will also be supported if they are in support of the lab-to-fab prototype. (e.g., BA 2 activities may be needed to support iterative development, and BA 4 activities may be needed to support the transition of a project to DoD demonstrators.)

For further discussion on research, development, testing, and evaluation (RDT&E) budget activities, see the DoD Financial Management Regulation, DoD 7000.14-R, Volume 2B, Chapter 5. (VOLUME_2B (defense.gov).

For further discussion on Manufacturing Readiness Levels (MRLs), see the Manufacturing Readiness Level (MRL) Deskbook, Version 2.0. https://www.dodmrl.com/MRL_Deskbook_V2.pdf

Microelectronics Commons will support prototype projects across six technical areas that are critical to the DoD. Those areas are: Secure Edge/Internet of Things Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead. Specifically, prototype projects that achieve the desired capabilities as described in the Desired Capabilities document (Attachments c-h) are being sought. The current state, desired end-state, and success criteria for those prototype projects are included in the Desired Capabilities document.

The end-state goal is microelectronics hardware-focused prototyping and lab-to-fab transition of semiconductor technologies. For lab-to-fab prototyping, the fab prototype must at least match if not exceed lab prototype technical specifications, and there must be a path to manufacturability in a Core (i.e., a foundry or fab). Projects that have been demonstrated in a lab and are ready for prototyping in a fab will have higher priority than lab prototyping projects.

View the full Call for Projects (CFP) under Key Documents on the right side of the page.

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Electromagnetic Warfare Projects

Electromagnetic Warfare Topic 1: Innovative Foundational AESA Building Blocks

Electromagnetic Warfare Topic 2: Multi-Chip Package with High-Speed Data Converters and In-Line Accelerators

Electromagnetic Warfare Topic 3: Same Frequency-Simultaneous Transmit and Receive (SF-STAR) Solutions

Electromagnetic Warfare Topic 4: Advanced GaN Technologies

Electromagnetic Warfare Topic 5: Multi-Chip Package for Cognitive Electronic Warfare

Electromagnetic Warfare Topic 6: Ultra-Wide Bandgap Semiconductors for Radio Frequency and Power Electronics

Electromagnetic Warfare Topic 7: Advanced Integration of Electro-Optic and Infrared (EO/IR) with Microelectronics

To view the full Electromagnetic Warfare projects, please refer to the technical guide found under Key Documents on the right side of the page.

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