Expanding the Domestic Microelectronics Industrial Base

Applying the latest and most comprehensive microelectronics technology to secure defense applications is critical for the continued and future success of our military. Advancing the functionality of microelectronic technology within the U.S. military commercial and defense partnerships has never been more important.

The Challenge

Currently, over 85% of microelectronics used in the United States are fabricated outside the U.S. Due to the complexity and market value of today’s integrated microelectronic systems and the lack of adequate on-shore prototyping in which intellectual property (IP) can be protected, there is an urgent need to establish a network of domestic prototyping facilities to demonstrate, at-scale, the system-level benefits of innovations in microelectronics materials, processes, devices, and architectural designs.

Demonstrating at-scale commercial viability is the missing requirement to close the gap between laboratory innovations and marketplace adoption.

The Solution

The DoD has made it a top priority to expand domestic microelectronics infrastructure through multiple programs managed through The Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) OTA, managed by NSTXL.

Enabling the commercial sector to help power the military and encourage technology growth is vital to the success of the contemporary Warfighter. Leveraging S2MARTS, the DoD is able to partner with innovators leading microelectronics development commercially, ensuring the same type of secure reliability in our military’s technology.

  • Microelectronics Commons
  • Rapid Assured Microelectronics Prototypes using Advanced Commercial Capabilities (RAMP)

  • Rapid Assured Microelectronics Prototypes Commercial (RAMP-C)
  • State of the Art Heterogeneous Integrated Packaging (SHIP)

  • Stimulating Transition for Advanced Microelectronics Packaging (STAMP)


Continue reading to learn more about each project.

Case Study

Establishing a Nationwide Microelectronics Network

The Microelectronics Commons created a national network of regional innovation hubs focused on onshoring Microelectronics and is the first major program to erect from the CHIPS and Science Act. In under three months, NSTXL executed a first-of-its-kind strategy to maximize program visibility and performer participation

This is an incredibly complex program requiring involvement from nine technology hubs across the U.S. Additionally, each hub needed the flexibility to respond quickly to emerging threats as they arise. To eliminate barriers to production, we created a multi-layered consortium network that will enable hubs to push projects to performers without requiring a full 100+ day project cycle.

  • Nationwide engagement from more than 20k commercial innovators.
  • Enabled sustained partnerships between emerging technology sources, manufacturing facilities, and interagency partners
  • Developed nine regional networks with the autonomy to respond to emerging threats without losing government oversight.

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Ramp Awareness Days

Microelectronics Commons Awareness Days Technical Capabilities Panel

Case Study

Onshoring Production to Face Emerging Defense Crisis

Most semiconductor companies manufacture their components offshore. To combat this, the DoD created three programs aimed at onshoring microelectronics and transitioning prototypes to the commercial market.

Through RAMP-C, Intel successfully provided a commercial foundry in Arizona where commercial organizations and the DoD can develop and fabricate test U.S. made microelectronics. With the opening of the foundry, phase 2 was awarded to continue the rapid prototyping of microelectronics to Microsoft and Qualcomm. The commercialization of these prototypes was celebrated in D.C. during RAMP Awareness Days in May, 2023

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New Intel Foundry in Chandler, Arizona.

Dr. Dev Shenoy, Principal Director, Microelectronics, OUSD(R&E) and Director of the Defense Microelectronics Cross Functional Team (DMCFT) during the SHIP Awareness Day in D.C.

Case Study

Prototype to Commercial Production

RAMP-C is complemented by two other programs including, Rapid Assured Microelectronics Prototypes using Advanced Commercial Capabilities (RAMP) and digital State of the Art Heterogeneous Integrated Packaging (SHIP). Through the SHIP Program, Intel and Qorvo have developed prototype devices that demonstrate enhanced capabilities and size, weight, and power (SWaP). The first two of these prototypes – Intel’s Multi-Chip Package (MCP-1) for SHIP Digital and Qorvo’s Multi-Chip Module (MCM-1) for SHIP RF – were delivered to the lead DIB demonstrator, BAE Systems, Inc., during a ceremonial gathering in Virginia this Spring.

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Obligated Funds Across Each OTA


Engaged Innovators


Average Days to Award


Collaboration Events Annually

We are building the largest network of commercial innovators to take mission-critical technologies to the next level.

Regardless of your DoD experience, your technology can help advance National Security. Just last year, our network contributed to some of the most prominent government projects worth more than $900M in value. Over half of these opportunities were awarded to ‘new to defense’ organizations.

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