State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Awareness Days

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You are cordially invited to attend the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) Awareness Day, hosted by the Office of the Secretary of Defense for Research & Engineering (OUSD(R&E)) Trusted & Assured Microelectronics Program (T&AM), October 12–13, 2022, at the Booz Allen Hamilton Conference Center in McLean, VA. SHIP prototype microelectronic devices are now in production and will be available to the DoD acquisition community and the Defense Industrial Base as standard products in 2023.  This event serves as an opportunity for engagement across the SHIP stakeholder enterprise to discuss current efforts and build the foundation for SHIP device transition to DoD systems.

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